Novel via Chain Structure for Failure Analysis at 65 nm-Node Fixing OPC Using Inner and Outer via Chain Dummy Patterns

Authors

Takashi NASUNO
Yoshihisa MATSUBARA
Hiromasa KOBAYASHI
Akiyuki MINAMI
Eiichi SODA
Hiroshi TSUDA
Koichiro TSUJITA
Wataru WAKAMIYA
Nobuyoshi KOBAYASHI

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Published

2005-05-01

Issue

Vol. E88-C, No. 5 May 2005

Section

Papers